| Pembekal Peranti Pakej: | 676-FBGA (27x27) |
|---|---|
| Speed: | 166MHz |
| Siri: | SmartFusion®2 |
| sifat utama: | FPGA - 60K Logic Modules |
| Peripherals: | DDR, PCIe, SERDES |
| pembungkusan: | Tray |
| Pakej / Kes: | 676-BGA |
| Suhu Operasi: | -40°C ~ 100°C (TJ) |
| Bilangan I / O: | 387 |
| MCU RAM: | 64KB |
| MCU Flash: | 256KB |
| Processor Core: | ARM® Cortex®-M3 |
| Kesambungan: | CAN, Ethernet, I²C, SPI, UART/USART, USB |
| Architecture: | MCU, FPGA |
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